MAX96717GTJ/VY+T
ADI(亚德诺) integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
Micron DDR3L SDRAM memory, 4Gb density, commercial temperature, for embedded systems.
This device is a Micron DDR3L synchronous dynamic random-access memory (SDRAM) with a density of 4Gb, organized as 256M x 16 bits. It features a 1.35V low-voltage design, supports high-speed data transfer, and is suitable for embedded applications requiring low power and high bandwidth. The commercial temperature range is suitable for general indoor environments. It is commonly used in networking equipment, industrial control, and consumer electronics, providing temporary data storage and fast read/write capabilities for systems.
When purchasing, verify the model suffix, including speed grade, temperature range, package type, and packaging method, to ensure alignment with design requirements. It is recommended to obtain the latest information from the original manufacturer or authorized channels.
Verify product details against the manufacturer datasheet before purchase.
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