MAX96717GTJ/VY+T
ADI(亚德诺) integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
Micron DDR3L SDRAM memory chip for data buffering and working memory.
This device is a Micron DDR3L synchronous dynamic random-access memory (SDRAM). The 512M16 in the model indicates density and organization, 107 denotes the speed grade, and IT indicates the industrial temperature range. DDR3L is a low-voltage DDR3 memory commonly used in electronic equipment requiring dynamic RAM, providing temporary data storage and read/write buffering for processors. Its FBGA package suits high-density mounting and is widely used in networking equipment, industrial control, and embedded computing platforms. Refer to the original datasheet for specific density, voltage, and timing parameters.
When purchasing, verify that the speed grade, temperature grade, and package code in the model suffix match requirements, and confirm original factory packaging. As original documentation is not provided, electrical parameters such as density, voltage, and timing are not listed here; consult the corresponding datasheet before selection.
Verify product details against the manufacturer datasheet before purchase.
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