MAX96717GTJ/VY+T
ADI（亚德诺） integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
MT53E1G32D2FW-046 WT:C
Micron LPDDR4 mobile memory, 1G x 32-bit, for mobile devices.
- Product Code
- DH61FB75A0
- Brand
- Micron/美光
- Package
- FBGA
- Packaging
- —
- Category
- Integrated Circuits
- Weight
- —
DatasheetNo verified manufacturer datasheet available yet
DESCRIPTION
Description
OVERVIEW
Product Overview
This device is a Micron LPDDR4 mobile memory chip in FBGA package. The capacity and bit-width info in the model number suggests it is suitable for mobile and embedded devices requiring low-power, high-bandwidth memory, such as smartphones and tablets. Please refer to the original manufacturer datasheet for specific electrical parameters, speed grades, and operating temperature range.
APPLICATIONS
Applications
- Used for memory storage in smartphones and tablets.
- Suitable for embedded systems requiring low-power memory.
- Can be used for data caching in portable consumer electronics.
- Ideal for mobile computing scenarios with power and bandwidth requirements.
FEATURES AND BENEFITS
Features and Benefits
- LPDDR4 memory technology helps reduce power consumption.
- FBGA package suitable for high-density mounting.
- 1G x 32-bit organization provides a certain bit width.
- Optimized for mobile devices with energy efficiency.
- Specific speed, voltage, and other parameters require original manufacturer documentation.
ADDITIONAL DETAILS
Additional Details
When purchasing, verify the full model number, batch, and packaging. Confirm required speed grade, operating temperature range, and other parameters. Since no original manufacturer documentation is provided, refer to the official datasheet for specific electrical characteristics.
Verify product details against the manufacturer datasheet before purchase.
REQUEST A QUOTE
Quote for MT53E1G32D2FW-046 WT:C
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