MAX96717GTJ/VY+T
ADI(亚德诺) integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
Micron LPDDR4 memory chip for mobile and embedded device memory.
This device is a Micron LPDDR4 low-power double-data-rate synchronous dynamic random-access memory. In the model, 512M32 relates to density and organization, 046 relates to speed grade, AIT relates to temperature and product grade, and ZW and :B relate to package and revision identifiers. LPDDR4 targets low-power, high-bandwidth memory applications, providing working memory for processors in mobile devices, automotive electronics, and embedded platforms. The FBGA package suits high-density mounting. Refer to the original datasheet for density, voltage, data rate, and other parameters.
When purchasing, verify the density, organization, speed grade, and temperature grade suffixes in the model against design requirements, and confirm package and packaging. As original documentation is not provided, specific parameters such as voltage and data rate are not listed here; refer to the corresponding datasheet.
Verify product details against the manufacturer datasheet before purchase.
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