MAX96717GTJ/VY+T
ADI(亚德诺) integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
NAND flash memory for embedded data storage.
The THGBMJG6C1LBAIL is a NAND flash memory device from KIOXIA in a BGA package. It is a non-volatile memory integrated circuit that retains data after power loss, commonly used in embedded systems, mobile devices, and consumer electronics to store firmware, operating systems, and user data. Its interface and storage capacity should be determined from the original datasheet. Recommended erase/write timing and bad block management strategies should be followed, and the operating temperature range should be observed. Specific electrical characteristics and endurance specifications should refer to the original documentation.
When purchasing, confirm the BGA package specifications and storage capacity match the design, and verify the operating temperature grade. Endurance or lifetime data not provided in original documentation should not be assumed.
Verify product details against the manufacturer datasheet before purchase.
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