MAX96717GTJ/VY+T
ADI（亚德诺） integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
W25Q64JVSSIQT
WINBOND integrated circuits in SOIC-8 package.
- Product Code
- DH9F6EC341
- Brand
- WINBOND
- Package
- SOIC-8
- Packaging
- —
- Category
- Integrated Circuits
- Weight
- —
DatasheetNo verified manufacturer datasheet available yet
DESCRIPTION
Description
OVERVIEW
Product Overview
Winbond W25Q64JVSSIQT is a SPI NOR flash for code and data storage applications.
APPLICATIONS
Applications
- Firmware storage
- Data storage
- IoT devices
FEATURES AND BENEFITS
Features and Benefits
- 64Mb capacity
- SPI interface
- SOIC-8 package
ADDITIONAL DETAILS
Additional Details
Supports standard SPI, dual/quad output modes; pinout not specified.
Verify product details against the manufacturer datasheet before purchase.
REQUEST A QUOTE
Quote for W25Q64JVSSIQT
Submit your estimated quantity and contact details for a personal quote based on brand, lot and lead time.
+86 19065141374Mon–Sat 09:00–18:00 (GMT+8)