MAX96717GTJ/VY+T
ADI（亚德诺） integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
W664GG6RB-06
DDR4 SDRAM memory chip
- Product Code
- DH0335BDDF
- Brand
- Winbond/华邦
- Package
- VFBGA
- Packaging
- —
- Category
- Integrated Circuits
- Weight
- —
DatasheetNo verified manufacturer datasheet available yet
DESCRIPTION
Description
OVERVIEW
Product Overview
This product is a DDR4 SDRAM chip from Winbond, featuring high bandwidth and low power consumption, suitable for servers, computers, and high-end embedded systems.
APPLICATIONS
Applications
- Servers
- Personal computers
- High-end embedded systems
- Data centers
FEATURES AND BENEFITS
Features and Benefits
- DDR4 interface
- High bandwidth
- Low power consumption
ADDITIONAL DETAILS
Additional Details
Specific density and speed grade are not specified.
Verify product details against the manufacturer datasheet before purchase.
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Quote for W664GG6RB-06
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