MAX96717GTJ/VY+T
ADI（亚德诺） integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
W9864G6KH-6
512Mb SDR SDRAM memory chip
- Product Code
- DH76EF03EC
- Brand
- Winbond/华邦
- Package
- TSOP II
- Packaging
- —
- Category
- Integrated Circuits
- Weight
- —
DatasheetNo verified manufacturer datasheet available yet
DESCRIPTION
Description
OVERVIEW
Product Overview
This product is a synchronous dynamic random-access memory (SDRAM) from Winbond, with a density of 512Mb and an SDR interface, suitable for embedded systems requiring high capacity and fast data access.
APPLICATIONS
Applications
- Embedded systems
- Networking equipment
- Industrial control
- Communication devices
FEATURES AND BENEFITS
Features and Benefits
- Synchronous DRAM interface
- 512Mb density
- 3.3V operating voltage
ADDITIONAL DETAILS
Additional Details
Specific frequency and timing parameters are not provided.
Verify product details against the manufacturer datasheet before purchase.
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Quote for W9864G6KH-6
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