MAX96717GTJ/VY+T
ADI（亚德诺） integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
XCZU47DR-2FFVE1156I
Zynq UltraScale+ RFSoC integrating RF and multi-core processor.
- Product Code
- DH77AEDA42
- Brand
- Xilinx/赛灵思
- Package
- BGA-1156
- Packaging
- —
- Category
- Integrated Circuits
- Weight
- —
DatasheetNo verified manufacturer datasheet available yet
DESCRIPTION
Description
OVERVIEW
Product Overview
High-performance programmable SoC integrating ARM processor and RF data converters, for wireless communications, radar and other RF applications.
APPLICATIONS
Applications
- 5G communications
- Radar systems
- Satellite communications
- Electronic warfare
- Medical imaging
FEATURES AND BENEFITS
Features and Benefits
- ARM multi-core processor
- Integrated RF ADC/DAC
- High-performance FPGA fabric
- Reconfigurable
- High-speed interfaces
ADDITIONAL DETAILS
Additional Details
Industrial temperature grade, 1156-pin ball grid array package.
Verify product details against the manufacturer datasheet before purchase.
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