MAX96717GTJ/VY+T
ADI（亚德诺） integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
K3LK7K70BM-BGCP
Samsung UFS storage chip, embedded flash memory, capacity unknown.
- Product Code
- DHAB0443EF
- Brand
- Samsung/三星半导体
- Package
- BGA
- Packaging
- —
- Category
- Integrated Circuits
- Weight
- —
DatasheetNo verified manufacturer datasheet available yet
DESCRIPTION
Description
OVERVIEW
Product Overview
K3LK7K70BM-BGCP is Samsung UFS device for high-performance mobile storage, BGA package, capacity and version unspecified.
APPLICATIONS
Applications
- Smartphones
- Tablets
- Automotive infotainment
FEATURES AND BENEFITS
Features and Benefits
- High-speed interface
- Embedded storage
- Non-volatile
ADDITIONAL DETAILS
Additional Details
No capacity or UFS version provided.
Verify product details against the manufacturer datasheet before purchase.
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Quote for K3LK7K70BM-BGCP
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