MAX96717GTJ/VY+T
ADI（亚德诺） integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
KMQE60013B-B318
Samsung eMMC memory chip, model KMQE60013B, capacity unknown.
- Product Code
- DHEFD15CD2
- Brand
- Samsung/三星半导体
- Package
- BGA
- Packaging
- —
- Category
- Integrated Circuits
- Weight
- —
DatasheetNo verified manufacturer datasheet available yet
DESCRIPTION
Description
OVERVIEW
Product Overview
This model is Samsung eMMC embedded memory chip, in BGA package, used for data storage in portable devices, etc. Specifics unknown.
APPLICATIONS
Applications
- Smartphones
- Tablets
- Embedded systems
FEATURES AND BENEFITS
Features and Benefits
- Embedded storage
- BGA package
ADDITIONAL DETAILS
Additional Details
No specific parameters such as capacity or speed provided.
Verify product details against the manufacturer datasheet before purchase.
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Quote for KMQE60013B-B318
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