MAX96717GTJ/VY+T
ADI（亚德诺） integrated circuits in TQFN-32 package.
- Package
- TQFN-32
Illustration for selection reference only
MX30LF2G18AC-TI
Parallel NAND flash memory chip for code and data storage.
- Product Code
- DH9A3EC54E
- Brand
- MXIC/旺宏
- Package
- TSOP
- Packaging
- —
- Category
- Integrated Circuits
- Weight
- —
DatasheetNo verified manufacturer datasheet available yet
DESCRIPTION
Description
OVERVIEW
Product Overview
This device is a parallel NAND flash memory chip from Macronix in a TSOP package, used for non-volatile code and data storage in embedded systems. It retains data after power loss and is suitable for firmware, boot code, and user data. The interface is parallel and requires a controller supporting the corresponding NAND interface. Specific density, page size, block structure, timing, and voltage levels must be based on the manufacturer datasheet.
APPLICATIONS
Applications
- Used for firmware and boot code storage in embedded systems.
- Used for program storage in routers, set-top boxes, and similar equipment.
- Used for data logging and storage in industrial control equipment.
- Used for non-volatile data retention in consumer electronics.
FEATURES AND BENEFITS
Features and Benefits
- Non-volatile storage retains data after power loss.
- Parallel interface suitable for embedded systems requiring faster read rates.
- TSOP package facilitates conventional assembly and rework.
- Targets applications requiring mixed code and data storage.
ADDITIONAL DETAILS
Additional Details
During procurement, confirm density, page and block sizes, interface timing, operating voltage, and temperature grade from the manufacturer, and verify package and pin definitions. Since no manufacturer data is provided, do not infer specific memory specifications or performance from the part number.
Verify product details against the manufacturer datasheet before purchase.
REQUEST A QUOTE
Quote for MX30LF2G18AC-TI
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