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32-bit microcontroller based on Arm Cortex-M4 core for embedded control and signal processing.
32-bit microcontroller based on Arm Cortex-M0+ core for general embedded control.
32-bit microcontroller based on Arm Cortex-M0+ core in UFQFPN28 package.
32-bit microcontroller based on Arm Cortex-M4 core for embedded control and signal processing.
32-bit microcontroller based on Arm Cortex-M4 core in UFQFPN48 package.
32-bit microcontroller based on ARM Cortex-M3 core for embedded control and general processing.
ST/意法半导体 integrated circuits.
8-bit serial-in parallel-out shift register for output port expansion.
TI/德州仪器 integrated circuits in SC70-5 package.
TI/德州仪器 integrated circuits in SOIC-8 package.
RS-485 half-duplex transceiver for industrial differential bus communication.
RS-485 half-duplex transceiver for industrial differential bus communication.
Bidirectional bus buffer for extending I2C bus communication distance and capacitive load capability.
Dual low-offset operational amplifier for precision signal conditioning and instrumentation circuits.
DDR3L synchronous dynamic random-access memory chip for data buffering and runtime memory.
Low-power Bluetooth wireless communication chip for short-range wireless connectivity and control.
Serial NAND flash memory chip for storing code and data.
Serial NOR flash memory chip for storing code and configuration data.
Serial NOR flash memory chip for embedded code and data storage.
Serial NOR flash memory chip for code and data storage.
Micron LPDDR4 mobile memory, 1G x 32-bit, for mobile devices.
Micron LPDDR4 mobile memory, 1G x 16-bit, for mobile devices.
MPS synchronous step-down converter for power management.
Microchip CAN transceiver for CAN bus communication.