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Bidirectional bus buffer for extending I2C bus communication distance and capacitive load capability.
Dual low-offset operational amplifier for precision signal conditioning and instrumentation circuits.
DDR3L synchronous dynamic random-access memory chip for data buffering and runtime memory.
Low-power Bluetooth wireless communication chip for short-range wireless connectivity and control.
Serial NAND flash memory chip for storing code and data.
Serial NOR flash memory chip for storing code and configuration data.
Serial NOR flash memory chip for embedded code and data storage.
Serial NOR flash memory chip for code and data storage.
Micron LPDDR4 mobile memory, 1G x 32-bit, for mobile devices.
Micron LPDDR4 mobile memory, 1G x 16-bit, for mobile devices.
MPS synchronous step-down converter for power management.
Microchip CAN transceiver for CAN bus communication.
onsemi bridge rectifier for AC to DC conversion.
Dual-channel RS-232 transceiver for serial communication level shifting.
Quad-channel step-down DC/DC module with integrated inductors and controllers for point-of-load power.
6-axis inertial measurement unit integrating a 3-axis accelerometer and a 3-axis gyroscope.
6-axis inertial measurement unit integrating a 3-axis accelerometer and a 3-axis gyroscope.
ARM Cortex-M3 based microcontroller for embedded control applications.
Step-down power module with integrated inductor for stable DC voltage supply.
Wideband RF synthesizer for generating high-frequency signals.
Cable equalizer for compensating high-speed signal transmission losses.
Automotive-grade step-down power module for automotive electronic systems.
Automotive-grade step-down power module for automotive electronic systems.
Wide-input boost, flyback, and SEPIC controller for automotive power supplies.